PCB design Engineer

Zigen Corporation

Responsibilities include the design and layout of digital and analog high density multi-layer PCB’s.

Key Job Responsibilities:

  • Perform PCB component placement, PCB routing, and design release documentation for Printed Circuit Boards.
  • Design component footprints for the Master Component Library.
  • Coordinate and participate in hardware product development activities.
  • Evaluate new PCB ECAD design/validation tools.
  • Write scripts to automate routine tasks associated with E-CAD applications, databases, and libraries.
  • Support schematic capture, netlist, generation and circuit board layout.
  • Monitor operating procedures and other internal documentation for completeness and manage updates.
  • Provide guidance to design engineers on practical constraints of PCB layout

Professional Qualities:

  • Willing to dive into and take ownership of critical design issues.
  • A strong ability to multitask and support multiple projects at one time.
  • Eager to work in a fast paced development environment.
  • Must have strong interpersonal skills and be self-motivated.
  • Completes tasks in a timely manner.
  • Flexible & able to quickly adapt to changing conditions and make decisions based on incomplete data
  • Strong verbal and written communications skills.


  • 5+ years of experience in PCB design
  • Experience with Printed Circuit Board tools. Altium Designer is preferred.
  • Experienced with high density multilayer printed circuit board layout, using surface mount (i.e. IPC-SM-782), modular and discrete technologies.
  • Experience in Analog and digital layout hybrid designs
  • A strong experience in HD/UHD video PCB design and audio routing practices
  • Design background in all design phases to include heat transfer, impedance control, EMI, circuit compatibility, shielding, critical circuit patterns as well as reliability and vibration/stress.
  • Experienced with all variations and PCB configurations to include back panel, memory, flex, component and power supply layout/design.
  • Experienced with HDI methodologies such as layer stackups and impedance issues, and HDI applications in the use of BGA, uBGA, blind and buried vias and via in pad.
  • Design of printed wiring boards requiring the implementation of differential pairs, high speed clock nets and ohmic line concerns.
  • Ability to read and interpret electronic schematics and component datasheets.
  • PCB verification tools
  • Rules/constraint based design practices
  • ECAD to MCAD integration
  • Experience with PCB fabrication and electronics manufacturing process (DFM, DFT, DFA)
  • Working knowledge of volume production, process and quality
  • Working knowledge of computers, electronics, and standard software applications.

To apply for this job email your details to info@zigencorp.com

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